* Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values. .

Preface. Contributors. 1. Basic Concepts (Allan D. Kraus). 2. Thermophysical Properties of Fluids and Materials (R. T Jacobsen, E. W. Lemmon, S. G. Penoncello, Z. Shan, and N. T. Wright). 3. Conduction Heat Transfer (A. Aziz). 4. Thermal Spreading and Contact Resistances (M. M. Yovanovich and E. E. Marotta). 5. Forced Convection: Internal Flows (Adrian Bejan). 6. Forced Convection: External Flows (Yogendra Joshi and Wataru Nakayama). 7. Natural Convection (Yogesh Jaluria). 8. Thermal Radiation (Michael F. Modest). 9. Boiling (John R. Thome). 10. Condensation (M. A. Kedzierski, J. C. Chato, and T. J. Rabas). 11. Heat Exchangers (Allan D. Kraus). 12. Experimental Methods (José L. Lage). 13. Heat Transfer in Electronic Equipment (Avram Bar-Cohen, Abhay A. Watwe, and Ravi S. Prasher). 14. Heat Transfer Enhancement (R. M. Manglik). 15. Porous Media (Adrian Bejan). 16. Heat Pipes (Jay M. Ochterbeck). 17. Heat Transfer in Manufacturing and Materials Processing (Richard N. Smith, C. Haris Doumanidis, and Ranga Pitchumani). 18. Microscale Heat Transfer (Andrew N. Smith and Pamela M. Norris). 19. Direct Contact Heat Transfer (Robert F. Boehm). Author Index. Subject Index. About the CD-ROM.

The most thorough and up-to-date coverage of heat transfer concepts and applications The Heat Transfer Handbook provides succinct hard data, formulas, and specifications for the critical aspects of heat transfer, offering a reliable, hands-on resource for solving day-to-day issues across a variety of applications. From the basics to the state of the art, this authoritative reference is the complete single-source handbook of need-to-know information in the industry. With today's professionals in mind, thirty world-renowned experts contribute cutting-edge concepts and applications, as well as insights into the current state of the field and the latest technologies. Standout features of the handbook include the most comprehensive coverage available on contact resistance, and well-conceived, timely material on heat transfer in electronic components. An accompanying CD-ROM containing the NIST Thermodynamic and Transport Properties of Pure Fluids Database: Version 5.1 provides computer formulations with the most up-to-date values for thermophysical properties of fluids and materials. For busy engineers and researchers, the Heat Transfer Handbook is the fast and accurate solution to their everyday needs.