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3D Integration for VLSI Systems

Tan Chuan Seng Chen Kuan-Neng Koester Steven J.
Innbundet / 2011 / Engelsk

Produktdetaljer

ISBN
9789814303811
Publisert
2011-09-26
Utgiver
Vendor
Pan Stanford Publishing Pte Ltd
Vekt
636 gr
Høyde
229 mm
Bredde
152 mm
Aldersnivå
U, P, 05, 06
Språk
Product language
Engelsk
Format
Product format
Innbundet
Antall sider
378

Redaktør
Tan Chuan Seng
Chen Kuan-Neng
Koester Steven J.

3D Integration for VLSI Systems

Tan Chuan Seng Chen Kuan-Neng Koester Steven J.
Innbundet / 2011 / Engelsk
Tan Chuan Seng Chen Kuan-Neng Koester Steven J.
Innbundet / 2011 / Engelsk
Nettpris:
1.938,-
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<p>"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology."<br />—Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA</p>

<p>"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology."<br />—Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA</p>

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.
Les mer
3D Integration Technology – Introduction and Overview. A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For? Wafer Bonding Techniques. TSV Etching. TSV Filling. 3D Technology Platform: Temporary Bonding and Release. 3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling. Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology. Advanced Direct Bond Technology. Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration. Through Silicon Via Implementation in CMOS Image Sensor Product. A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through- Silicon Via and Hybrid Cu-Adhesive Bonding. Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells. Thermal-Aware 3D IC Designs. 3D IC Design Automation Considering Dynamic Power and Thermal Integrity. Outlook.
Les mer

Relaterte produkter

<p>"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology."<br />—Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA</p>

<p>"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology."<br />—Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA</p>

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.
Les mer
3D Integration Technology – Introduction and Overview. A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For? Wafer Bonding Techniques. TSV Etching. TSV Filling. 3D Technology Platform: Temporary Bonding and Release. 3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling. Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology. Advanced Direct Bond Technology. Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration. Through Silicon Via Implementation in CMOS Image Sensor Product. A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through- Silicon Via and Hybrid Cu-Adhesive Bonding. Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells. Thermal-Aware 3D IC Designs. 3D IC Design Automation Considering Dynamic Power and Thermal Integrity. Outlook.
Les mer

Produktdetaljer

ISBN
9789814303811
Publisert
2011-09-26
Utgiver
Vendor
Pan Stanford Publishing Pte Ltd
Vekt
636 gr
Høyde
229 mm
Bredde
152 mm
Aldersnivå
U, P, 05, 06
Språk
Product language
Engelsk
Format
Product format
Innbundet
Antall sider
378

Redaktør
Tan Chuan Seng
Chen Kuan-Neng
Koester Steven J.

Relaterte produkter